欧美在线专区-欧美在线伊人-欧美在线一区二区三区欧美-欧美在线一区二区三区-pornodoxxx中国妞-pornodoldoo欧美另类


Sitemap | RSS | XML | CN |
深圳市托普科實業有限公司

產品分類

Contact

SHENZHEN TOPQUALITY INDUSTRY CO,.LTD

SHENZHEN TEPCO ELECTRONIC EQUIPEMENT CO., LTD.

Contacts：Mr. Xiang +86-15811551336

E-mail：market@topsmt.com


Wafer Plating – Stratus? P300

Your current location: 首 頁 >> Products >> Semiconductor

Wafer Plating – Stratus? P300

  • Classification:Semiconductor

    • Characteristic：
  • Message
  • Content

Wafer Plating – Stratus? P300

ECD 300 – 200 mm Wafer Processing

Applications

  • Configurable for up to 6 metals

  • UBM/RDL

  • Fan Out

  • RF Filters

  • Power Devices

Features

  • Dual wafer size capability

  • Membrane Cells for long bath stability

  • ShearPlate? technology for thinnest boundary layer

  • Substrate handling flexibility

Substrates

  • 300 and 200 mm wafers

  • Silicon, eWLB, Bonded, Carrier


Website of this article:http://www.vadq7w5p.cn/product/803.html

Tag：

Prev:Panel Plating – Stratus? P500
Next:Aluminum Wedge Bonding AB589 Series

最近瀏覽：

Related products:

Related news:

Contact

E-mail：market@topsmt.com

Contacts：Mr. Xiang +86-13510329527

website：：www.vadq7w5p.cn

In order to facilitate our better service to you, please leave your valuable suggestions:

Name*
Contact*
Content*